Flip Chip on Flexible Circuitry
High volume flip chip on flexible circuitry is routine at Automated Assembly. The original roll-to-roll process developed at Automated Assembly was created specifically for flip Chip assembly onto one thousand foot rolls of circuitry. The flip Chip Die is bonded using solder interconnects to a variety of substrates including Polyimide, PEN and even Polyester materials.
The use of solder for bonding flip chips is recommended because the interconnect has good mechanical strength and superior electrical performance. Conductive adhesive may also be used as an interconnect when assembling flip chips. The electrical and mechanical properties of conductive adhesive are not as robust as solder, however conductive adhesive bonded flip chips may be suitable for ambient environment applications. For more information on the suitability of conductive adhesive, please consult with our experts.
Our Flip Chip assembly capability offers unlimited possibilities in creating products that can meet your design and cost parameters. Our vast experience helps assure that our process and materials will meet the challenges or your product requirements.
Flip-Chip-on-Flex technology can be used in a wide variety of applications in Markets requiring RFID or micro-electronics:
- RFID
- Medical Applications
- Telecommunications
- Consumer Products
- Sensors
We have yet to utilize our full potential in working with flip chip technology. We welcome the opportunity to demonstrated our skills and abilities. Flip-Chip-on-Flex makes a wide variety of applications possible: Radio Frequency Identification “RFID,” Smart Cards, Hearing Aids, Toll Way Tracking, Cell Phones, Credit Cards, Video Gambling, Satellite TV, LAN, WIFI Technology, the possibilities are endless. Automotive Applications |

.070" X .070" bare die flip chip attached with .003' solder as the interconnect. |
With Automated Assemblies expertise and capability, the possibilities are endless. Contact us today for more information on our flip chip products and processes.
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