News

Automated Assembly Corporation, Lakeville, Minnesota, USA and Fuji Machine Manufacturing Company, Nagoya, Japan, Announce the FIRST Roll-2-Roll SMT DIE from Wafer Placement Machine Delivered in the USA and will be displayed at IPC APEX EXPO 2018 LAKEVILLE, MINNESOTA & NAGOYA, JAPAN — (BUSINESS WIRE) — AUTOMATED ASSEMBLY CORPORATION and FUJI MACHINE MANUFACTURING COMPANY LTD., today announced the purchase […]

The 30th annual MD&M West conference will be held next week in Anaheim, CA.  Automated Assembly will be among the exhibitors at the conference from February 10-12th. In this 30th Anniversary year of MD&M West, the Medical Conferences present 3 tracks, featuring Disruptive Innovation in Design of Medical Devices; Managing Risk, Quality, and Validation; and […]

What is Near Field Communication and how does it work ? Near Field Communication (NFC) is a wireless communication technology similar to Bluetooth but rather than requiring someone to set it up, NFC connections are made automatically when devices are held within two inches of each other and the transfer of data is completed.  Two […]

Automated Assembly CEO, Scott Lindblad was honored to be interviewed by Cyndy Brucato for the “Greater MSP” Business show about the history of manufacturing flexible circuits.  The show aired on January 26, 2013 at 10:30 A.M. Automated Assembly Corporation was selected by Greater MSP as a great example of the type of advanced technology manufacturing […]

Automated Assembly Corporation’s laminating capability enables us to provide our RFID package with a cover film and adhesive on the bottom side for ease of assembly.  Our inline digital imaging capability allows us to print high quality graphics on the cover film in a cost effective manner. Each part can have a unique brand name […]

Scott Lindblad is the inventor and patent holder of Surface Mount Flex (SMF) technology in Reel-to-Reel formats. SMF innovation was born through Automated Assembly Corporation.  With us, it continues to grow into new applications” -Scott Lindblad, Founder and Owner of AAC Automated Assembly Corporation is a world-class leader in surface mount technology.  Through the use […]

Automated Assembly Corporation has laser cutting and excising capability.  This capability saves time and money by eliminating the process of tooling.  AAC provides fast turn prototypes with high quality part definition.  Our laser system has vision registration and high accuracy repetition.  Laser cut products are available in discrete part or in roll to roll form. […]

High volume flip chip on flexible circuitry is routine at Automated Assembly.  The original roll-to-roll process developed at AAC was created specifically for flip chip assembly onto one thousand foot rolls of circuitry.  The flip chip die is bonded using solder inter-connects to a variety of substrates including Polyimide, PEN and even Polyester materials. The […]

Automated Assembly Corporation is a world leader in high volume Roll-to-Roll flexible circuit assembly and polyester RFID technology.  Our products are 100 times more reliable in thermally active environments than conductive adhesives.  Our Roll-to-Roll process begins with rolls that are over 3 football fields in length and only 12″ wide.  The process uses 100% optical […]

Automated specializes in designing and building Rugged RFID tags that can withstand harsh environments.   Most RFID tags fail when exposed to temperature variations, but our RFID tags have proven mechanically robust,  surviving even the rough handling of baggage and package transportation. Other technologies such as anisotropic and conductive polymer adhesives typically fail after only […]