NFC Tags

NFC Tags Graphics: NFC Tag Technology: Patented Wire-Write® Technology is our latest release in NFC technology.  With Wire-Write® the etching of the flex circuit and standard inlay technology is eliminated.  Wire-Write® is 100% additive technology eliminating all chemicals in the manufacturing process, and eliminating the inlay layer.  Our NFC tags are very robust, or tamper […]

SMT Flex™ 32 Years Strong

Its hard to believe 32 years ago I populated my first SMT Flex® circuit, using Serial#2 Pick and Place machine in the world, and produced the first ABS break circuits for Texas Instruments.   Roll to Roll SMT Micro Assembly Automated Assembly Corporation SMT-Flex® Thermal Shock Back in the day, SMT Flex® was chosen due […]

First SMT Roll-2-Roll Die from Wafer Placement Machine Delivered in the USA

Automated Assembly Corporation®, Lakeville, Minnesota, USA and Fuji Machine Manufacturing Company, Nagoya, Japan, Announce the FIRST SMT Flex Roll-2-Roll (R2R) SMT DIE from Wafer Placement Machine Delivered in the USA and will be displayed at IPC APEX EXPO 2018 Roll To Roll Die Placement: LAKEVILLE, MINNESOTA & NAGOYA, JAPAN — (BUSINESS WIRE) — AUTOMATED ASSEMBLY CORPORATION®  and […]

MD&M West 2019 February 5-7

MD&M West 2019 Expo is February 5-7.  Anaheim Convention Center, Anaheim, CA Automated Assembly™ will host a number of new inventions at MD&M 2019. Wire-Write™ Flexible Heaters: Wire-Write™ flexible heaters are manufactured using 100% additive processing.  Our heaters can be manufactured on standard films such as Polyester, PEN, or Polyimide.  Since we have no chemicals […]

Near Field Communication (NFC) For Beginners

What is Near Field Communication and how does it work ? Near Field Communication (NFC) is a wireless communication technology similar to Bluetooth but rather than requiring someone to set it up, NFC connections are made automatically when devices are held within two inches of each other and the transfer of data is completed.  Two […]

Scott Lindblad (CEO) Interviewed on Greater MSP About Flexible Circuits

Automated Assembly CEO, Scott Lindblad was honored to be interviewed by Cyndy Brucato for the “Greater MSP” Business show about the history of manufacturing flexible circuits.  The show aired on January 26, 2013 at 10:30 A.M. Automated Assembly Corporation was selected by Greater MSP as a great example of the type of advanced technology manufacturing […]

PSA Lamination

PSA Lamination: PSA Lamination on Roll-To-Roll Flexible Circuits.   Automated Assembly Corporation’s laminating capability enables us to provide Roll-To-Roll lamination services up to 48″ wide.  Typical lamination includes PSA, or thermal adhesives, vinyl, and Polyester layers to the base flex circuit.  Lamination of clear liners over Digital Graphics, photographs, or protecting RFID package with a […]

Flex Circuit Assembly

Flex Circuit Assembly: Scott Lindblad is the inventor and patent holder of Surface Mount Flex (SMT-Flex) technology. Flex Circuit Assembly is available in sheet and in Reel-to-Reel formats. SMT Flex® innovation was born through Automated Assembly Corporation®.  With us, it continues to grow into new applications” -Scott Lindblad, Founder and Owner of Automated Assembly™ Flexible […]

Laser Cut

Laser Cut: Automated Assembly Corporation® has laser cut and excising capability.  This capability saves time and money by eliminating the process of tooling.  AAC provides fast turn prototypes with high quality part definition.  Our laser system has vision registration and high accuracy repetition.  Laser cut products are available in discrete part or in roll to […]

Flip Chip Assembly on Flex

Flip Chip on Flex: High volume flip chip Assembly on flex circuitry is routine at Automated Assembly™.  The original roll-to-roll process developed at AAC was created specifically for flip chip assembly onto one thousand foot rolls of circuitry.  The flip chip die is bonded using solder inter-connects to a variety of substrates including Polyimide, PEN […]